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silego technology, inc. rev 1.03 000-00055544-103 revised february 4, 2016 usb charging port power switch and controller SLG55544 block diagram general description silego SLG55544 is a combination of current-limited usb port power switch with a usb 2.0 high-speed data line (d+/d-) switch and usb charging port identification circuit. applications include notebook pcs and other intelligent usb host devices. the wide bandwidth (2.6 ghz) data-line switch also features low capacitance and low on resistance, allowing signals to pass with minimum edge and phase distortion. the SLG55544 monitors d+ and d-, providing the correct hand-shaking protocol with compliant client devices. features ? meets battery charging specification bc1.2 for dcp and cdp ? meets chinese telecommunications industry standard yd/t 1591-2009 ? supports non-bc 1.2 charging modes via automatic se- lection - dm/dp divider modes 2.7v/2.0v (1a) & 2.0v/2.7v (2a) - dm/dp 1.2v mode ? support smart-cdp function - automatic cdp/sdp mode support for always data communication ? compatible with usb 2.0/3.0 power switch requirements ? 73 m (typ) high side mosfet ? adjustable current limit up to 3.0 a (typ) ? pb-free / rohs compliant ? halogen-free ? tqfn-16 package / msl-1 ? ul listed and cb file no. e468659 pin configuration applications ? usb ports/hubs ? notebook pcs ? universal wall charging adapter 16-pin tqfn nc dp_in dm_in ctl2 ctl1 en SLG55544 9 6 7 11 10 15 14 13 5 fault# gnd ilim_l 1 2 3 dp_out dm_out vin gnd 4 ilim_sel ctl3 8 vout 12 16 ilim_h (top view) dp_in dm_in en fault# dp_out dm_out vin ilim_sel vout power switch control circuitry ctl1 charge logic ctl3 ctl2 charging downstream port mode bc divider mode bc 1.2 dcp mode / 1.2 v mode dedicated sense host sense charge mode select shorted/divider mode switch high band- width switch auto discharge current limit switch ilim_l ilim_h
000-00055544-103 page 2 of 19 SLG55544 pin description pin # name type description 1 vin pwr input voltage, connect a 0.1 f or greater ceramic capacitor from in to gnd as close to the device as possible 2 dm_out input/output d- data line to usb host controller 3 dp_out input/output d+ data line to usb host controller 4 ilim_sel input logic level input signal used to dynamically change power switch cur- rent-limit threshold; logic low sele cts ilim_l, logic high selects ilim_h 5 en input logic level control input for turnin g the power switch and the signal switches on/off. when en is low, the device is disabled, the signal and power switches are off. 6 ctl1 input logic level control inputs for c ontrolling the charging mode and the signal switches. the ?000? configuration is used to force and discharge of the output (vout) capacitor. 7 ctl2 input 8 ctl3 input 9 nc nc no connect. open or connect to ground 10 dp_in input/output d+ data line to connector, input/output used for hand-shaking with portable equipment 11 dm_in input/output d- data line to connector, input/output used for hand-shaking with portable equipment 12 vout pwr power switch output 13 fault# output active low open drain output , asserted during over-temperature or cur- rent-limit conditions 14 gnd gnd ground 15 ilim_l input external resistor used to set curre nt-limit threshold when ilim_sel is low. see current limit setting in detailed description. 16 ilim_h input external resistor used to set current-limit threshold when ilim_sel is high. see current limit setting in detailed description. 17 thermal pad gnd ground ordering information part number type SLG55544v tqfn-16 SLG55544vtr tqfn-16 - tape and reel
000-00055544-103 page 3 of 19 SLG55544 1. stresses beyond those listed under "absolute maximum rati ngs" may cause permanent damage to the device. these are stress ratings only and functional operation of the device at these or any other conditions beyond t hose indicated under "recommended operating conditions" is not implied. exposure to absolute-ma ximum-rated conditions for extended periods may affect device reliability. absolute maximum conditions 1 parameter min. max. unit supply voltage range vin -0.3 7 v input voltage range en, ilim_l, ilim_h , ilim_sel, ctl1, ctl2, ctl3 -0.3 7 v output voltage range vout, fault# -0.3 7 v output voltage range vin to vout -7 7 v voltage range dp_in, dm_in, dp_out, dm_out -0.3 vin+0.3 or 5.7 v input clamp current dp_in, dm _in, dp_out, dm_out -- 20 ma continuous current in sdp or cdp mode dp _in to dp_out or dm_in to dm_out -- 100 ma continuous current in bc1.2 dcp mode dp_in to dm_in -- 35 ma continuous output current internally limited continuous output sink current fault#, nc -- 25 ma continuous output source current ilim_l, ilim_h -- 1 ma continuous total power dissipation internally limited esd rating, human body model (hbm) vin, en, ilim_l, ilim_h, ilim_sel, ctl1, ctl2, ctl3, nc, out, fault# 2--kv esd rating, human body model (hbm) dp_in, dm_in, dp_out, dm_out 8 -- kv esd rating, charged device model 500 -- v operating temperature range -40 85 c storage temperature range -65 165 c
000-00055544-103 page 4 of 19 SLG55544 1. for more information about traditional and new thermal metri cs, see the ic package therma l metrics application report, spra953. 2. the junction-to-ambient thermal resistance under natural conv ection is obtained in a simulation on a jedec-standard, high-k board, as specified in jesd51-7, in an environment described in jesd51-2a. 3. the junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. no specific jedec-standard test exists, but a close description can be found in the ansi semi standard g30-88. 4. the junction-to-board thermal resistance is obtained by simu lating in an environment with a ring cold plate fixture to contr ol the pcb temperature, as described in jesd51-8. 5. the junction-to-top characterization parameter, jt , estimates the junction temperatur e of a device in a real system and is extracted from the simulation data for obtaining ja , using a procedure described in jesd51-2a (sections 6 and 7). 6. the junction-to-board ch aracterization parameter, jb , estimates the junction temperature of a device in a real system and is extracted from the simulation data for obtaining ja , using a procedure described in jesd51-2a (sections 6 and 7). 7. the junction-to-case (bottom) thermal resistance is obtained by simulating a cold plate test on the exposed (power) pad. no specific jedec standard test exists, but a close descrip tion can be found in the ansi semi standard g30-88. thermal information 1 parameter rte unit ja junction-to-ambient thermal resistance 2 53.4 c/w jctop junction-to-case (top ) thermal resistance 3 51.4 c/w jb junction-to-board thermal resistance 4 17.2 c/w jt junction-to-top charac terization parameter 5 3.7 c/w jb junction-to-board characterization parameter 6 20.7 c/w jcbot junction-to-case (bottom) thermal resistance 7 3.9 c/w recommended operating conditions over operating free-air temperatur e range (unless otherwise noted) symbol parameter condition/note min. typ. max. unit v in input voltage vin 4.5 -- 5.5 v logic level inputs (ctl1, ctl2, ctl3, en, ilim_sel) 0--5.5v data line inputs (dp_in, dm_in, dp_out, dm_out) -- -- 5.5 v continuous current data line inputs (sdp or cdp mode, dp_in to dp_out or dm_in to dm_out) -- -- 30 ma data line inputs (bc1.2 dcp mode, dp_in to dm_in) -- -- 15 ma r ilim current-limit set resistors ilim_l to gnd, ilim_h to gnd 16.9 -- 750 k t j operating virtual junction temperature -40 -- 125 c v ih input logic high 1.8 -- -- v v il input logic low -- -- 0.8 v v hyst input logic hysteresis -- 250 -- mv
000-00055544-103 page 5 of 19 SLG55544 electrical characteristics conditions are -40 t j 125c unless otherwise noted. v en = v in = 5 v, r fault# = 10 k , r ilim_l = 80 k , r ilim_h = 20 k , ilim_sel = v in , ctl1 = ctl2 = ctl3 = v in , unless otherwise noted. positi ve currents are into pins. typical values are at 25c. all voltages are with respect to gnd unless otherwise noted. electrical characteristics - power switch symbol parameter condition/note min. typ. max. unit rds on static drain-source on-state resistance 1 i out = 2 a, v ilim_sel = logic high -- 73 -- m i out = 100 ma, v ilim_sel = log- ic low -- 73 -- m -40c t a = t j 85c, i out = 2 a, v ilim_sel = logic high -- 73 -- m t a = t j = 25c, i out = 2 a, vilim_sel = logic high -- 73 -- m t r rise time, output c l = 1 f, r l = 100 ,0.71.01.6ms t f fall time, output c l = 1 f, r l = 100 , 0.2 0.35 0.5 ms r dis out discharge resistance 337 498 681 t dis out discharge hold time -- 2 -- s i rev reverse leakage current v out = 5.5 v, v in = v en = 0 v, t j = 25c -- -- 2 a electrical characteristics - input en symbol parameter condition/note min. typ. max. unit v en enable pin turn on/off threshold, falling -- 1.08 -- v v en_hys en hysteresis -- 230 1 -- mv i en input current v en = 0 v or 5.5 v -0.5 -- 0.5 a t on turn on time c l = 1 f, r l = 100 ,--2.74.0ms t off turn off time c l = 1 f, r l = 100 ,--1.73.0ms note: 1. typical value for reference only, not 100% tested. electrical characteristics - current limit symbol parameter condition/note min. typ. max. unit v ilim_sel ilim_sel turn on/off thresh- old, falling -- 1.08 -- v v ilim_hys ilim_sel hysteresis -- 230 1 -- mv ilim_sel input current v ilim_hys = 0 v or 5.5 v -0.5 -- 0.5 a
000-00055544-103 page 6 of 19 SLG55544 i short maximum dc output current from vin to vout v ilim_sel = logic low r ilim_l = 210k 0.22 0.26 0.30 a v ilim_sel = logic low r ilim_l = 80.6k -40c t j 85c 0.60 0.66 0.72 a v ilim_sel = logic low r ilim_l = 22.1k 2.120 2.275 2.430 a v ilim_sel = logic high r ilim_h = 20k 2.340 2.510 2.685 a v ilim_sel = logic high r ilim_h = 16.9k 2.77 2.97 3.17 a t ios response time to short cir- cuit v in = 5 v -- 6.65 1 -- s note: 1. typical value for reference only, not 100% tested. electrical characteristics - supply current symbol parameter condition/note min. typ. max. unit i ccl supply current, switch dis- abled v en = 0 v, out grounded, -40c t j 85c -- 0.1 2 a i cch supply current, operating v en = v in -- 215 270 a electrical characteristics - undervoltage lockout symbol parameter condition/note min. typ. max. unit v uvlo low level input voltage, in v in rising 3.9 4.1 4.3 v v in_hys hysteresis, in 100 1 mv note: 1. typical value for reference only, not 100% tested. electrical characteristics - fault# symbol parameter condition/note min. typ. max. unit v ol output low voltage, fault# i fault# = 1 ma -- -- 100 mv i leak off-state leakage v fault# = 5.5 v -- -- 1 a fault# deglitch fault# assertion or de-asser- tion due to over-current condi- tion -- 8.6 -- ms electrical characteristics - ctl inputs symbol parameter condition/note min. typ. max. unit v ctl ctl pins turn on/off thresh- old, falling -- 1.08 -- v v ctl_hys hysteresis, ctl -- 230 1 -- mv input current v ctl = 0 v or 5.5 v -0.5 -- 0.5 a note: 1. typical value for reference only, not 100% tested. electrical characteristics - current limit symbol parameter condition/note min. typ. max. unit
000-00055544-103 page 7 of 19 SLG55544 electrical characteristics - thermal shutdown symbol parameter condition/note min. typ. max. unit thermal shutdown threshold 155 -- -- c thermal shutdown threshold in current-limit 135 -- -- c hysteresis 20 1 c note: 1. typical value for reference only, not 100% tested. electrical characteristics - analog switch v in = 5.0 v, t a = 25 c (unless specified otherwise) symbol parameter condition/note min. typ. max. unit v dp_in , v dm_in analog signal range 0 -- v dd v r on on resistance dp_out/dm_out switch v dp/dm_out = 0 v, i dp/dm_in = 30 ma -- 2 4 v dp/dm_out = 2.4 v, i dp/dm_in = -15 ma -- 3 6 r on on resistance mismatch between channels dp_out/dm_out switch v in = 5 v v dp_in = v dm _in = 400 mv i dp_in = i dm_in = 10 ma -- 0.1 -- r flat on resistance flatness dp_out/dm_out switch v in = 5.0 v v dp_in = v dm_in = 0 v to v in i dp_in = i dm_in = 10 ma -- 0.5 -- r short on resistance of dp_out/dm_out short v cb = 0 v v dp_in = 1 v i dp_in = i dm _in = 10 ma -- 100 150 i dp_out_off , i dm_outoff off-leakage current v in = 3.6 v v dp_in = v dm_in = 0.3 v to 3.3 v v dp_out = v dm_out = 3.3 v to 0.3 v v en = 0 v -250 -- 250 na i dp_in_off , i dm_in_off off-leakage current v in = 3.6 v v dp_in = v dm_in = 3.3 v to 0.3 v v en = v in -250 -- 250 na electrical characteristics - dynamic performance v dd = 5.0 v, t a = 25 c (unless specified otherwise) symbol parameter condition/note min. typ. max. unit t on turn on time v dp_out or v dm_out = 1.5 v r l = 300 c l = 35 pf --? 20 100 s t off turn off time v dp_out or v dm_out = 1.5 v r l = 300 c l = 35 pf --? 1 5 s t plh , t phl dp_out/dm_out switch propagation delay r l = r s = 50 -- 60 -- ps
000-00055544-103 page 8 of 19 SLG55544 t skew output skew skew between dp_in and dm_in when connected to dp_out and dm_out r l = r s = 50 -- 40 -- ps c off dp_out/dm_out off-ca- pacitance f = 1 mhz --? 2.0 -- pf c on dp_in/dm_in on-capaci- tance f = 240 mhz --? 4.0 5.5 pf bw -3db bandwidth r l = r s = 50 -- 1000 -- mhz v iso off-isolation v dp_out, v dp_in = 0 dbm r l = r s =50 f = 250 mhz -- -20 -- db v ct crosstalk v dp_out, v dp_in = 0 dbm r l = r s = 50 f = 250 mhz -- -25 -- db electrical characteristics - dynamic performance v dd = 5.0 v, t a = 25 c (unless specified otherwise) symbol parameter condition/note min. typ. max. unit
000-00055544-103 page 9 of 19 SLG55544 parameter measurement information test circuit voltage waveform voltage waveforms response time to short-circuit waveforms i short
000-00055544-103 page 10 of 19 SLG55544 dcp bc1.2 operation vout discharge during ctl lines change
000-00055544-103 page 11 of 19 SLG55544 overview the following overview references variou s industry standards. it is always recommended to consult the most up-to-date standard to ensure the most recent and accurate information. rechargeable portable equipment requires an external power source to charge its batteries. usb ports are a convenient location fo r charging because of an available 5 v power source. universally accepted standards are required to make sure host and clie nt-side devices operate together in a system to ensure power management requirements are met. traditionally , usb host ports following the usb 2.0 s pecification must provide at least 500 ma to downstream client-side devices. because multiple usb de vices can be attached to a single usb port through a bus-pow- ered hub, it is the responsibilit y of the client-side device to negotiate its pow er allotment from the host to ensure the total current draw does not exceed 500 ma. in general, each usb device is granted 100 ma and may request more current in 100 ma unit steps up to 500 ma. the host may grant or deny based on the available current. additionally, the success of usb has made the mini-usb connector a popular choice for wall adapter cables. this allows a portable device to charge from both a wall adapter and usb port with only one connector. one common difficulty has resulted from this. as usb charging has gained popularity, the 500 ma minimum defined by usb 2.0 has become insufficient for many handset and personal media players which ne ed a higher charging rate. on the other hand, wall adapters can provide much more current than 500 ma. several new standards have been introduced defining protocol handshaking methods that allow host and client devices to acknowledge and draw additional current bey ond the 500 ma minimum defined by usb 2.0 while still using a single micro-usb input connector. the SLG55544 supports three of the most common protocols: ? usb 2.0 battery charging specification bc1.2 ? chinese telecommunications industry standard yd/t 1591-2009 ? divider mode all three methods have similarities and diff erences, but the biggest commonality is th at all three define three types of chargi ng ports that provide charging current to client-s ide devices. these charging ports are defined as: ? standard downstream port (sdp) ? charging downstream port (cdp) ? dedicated charging port (dcp) bc1.2 defines a charging port as a downstream facing usb port that provides power for charging portable equipment. the table below shows the differences between these ports according to bc1.2 (draft). bc1.2 (draft) defines the protocol necessary to allow portable equi pment to determine what type of port it is connected to so t hat it can allot its maximum allowable current draw. the hand-shakin g process has two steps. during step one, the primary detection , the portable equipment outputs a nominal 0.6-v output on its d+ line and reads the voltage input on its d- line. the portable d evice concludes it is connected to an sdp if the voltage is less than the nominal data detect voltage of 0.3 v. the portable device concludes that it is connected to a charging port if the d- voltage is greater than the nominal data det ect voltage of 0.3 v an d less than 0.8 v. the second step, the se condary detection, is necessary for por table equipment to determine between a cdp and a dcp. the portable device outputs a nominal 0.6 v output on its d- line and reads the voltage input on its d+ line. the portable device concludes it is connected to a cdp if the data line being read rema ins less than the nominal data detect voltag e of 0.3 v. the portable device concludes it is connected to a dcp if the data line being read is greater than the nominal data d etect voltage of 0.3v and less than 0.8 v. operating modes port type supports usb 2.0 communication maximum allowable current draw by portable equipment (a) sdp (usb 2.0) yes 0.5 sdp (usb 3.0) yes 0.9 cdp yes 1.5 dcp no 1.5
000-00055544-103 page 12 of 19 SLG55544 standard downstream port (sdp) an sdp is a traditional usb port that fo llows usb 2.0/3.0 and supplies a maximum of 500 ma per port for usb 2.0 and 900 ma per port for usb 3.0. usb 2.0 communicatio ns is supported, and the host controller must be active to allow charging. charging downstream port (cdp) a cdp is a usb port that follows usb 2.0/ 3.0 bc1.2 (draft) and supplies a minimum of 1.5 a per port. it provides power and meets usb 2.0/3.0 requirements for device en umeration. usb 2.0/3.0 comm unications is supported, and the host controller must be active to allow charging. what separates a cdp from an sdp is the host-charge handshaking logic that identifies this port as a cdp. a cdp is identifiable by a compliant bc1.2 (draft) client device and allows for additional current draw by the client de vice. the cdp hand-shaking process is two steps. during step one t he portable equipment outputs a nominal 0.6 v output on its d+ line and reads the voltage input on its d- line. the portable devi ce concludes it is connected to an sdp if the voltage is less than the nominal data detect voltage of 0.3 v. the portable device conclu des that it is connected to a charging port if the d- volta ge is greater than the nominal data detec t voltage of 0.3v and less than 0.8 v. the second step is necessary for portable equipment to determine between a cdp and a dcp. the portable device outputs a nominal 0.6 v output on its d- line and reads the voltage input on its d+ line. the portable device concludes it is connected to a cdp if the data line being read remains less than the nominal data detect voltage of 0.3 v. the portable device concludes it is co nnected to a dcp if the data line being read is greater than the nominal data detect volt age of 0.3v and less than 0.8 v. dedicated charging port (dcp) a dcp is a special type of wall-adapter used in charging applications that uses a mi cro-b connector to connect to portable devi ces. a dcp only provides power and does not support data connecti on to an upstream port. as shown in following sections, a dcp is identified by the electrical characteristics of its data lines. the SLG55544 emulates dcp in two charging states, namely dcp forced and dcp auto. in dcp forced state the device will su pport one of the following two dc p charging schemes: divider1 or shorted. in dcp auto state, the SLG55544 charge detection state machine is enabled which will selectively implement charging schemes involved with the shorted, div ider1, divider2, and 1.2 v modes. shorted dcp mode complies with bc1. 2 and chinese telecommunications industry standard yd/t 1591-2009, divider and 1.2v modes are used to charge devic es that do not comply with bc1.2 dcp standard. high-bandwidth data line switch the SLG55544 passes the d+ and d- data lines through the device to enable monitoring and handshaking while supporting charging operation. a wide bandwidth signal s witch is used, allowing data to pass th rough the device without corrupting signal integrity. the data line switches are turned on in any of cdp or sdp operating modes. the en input also needs to be at logic high for the data line switches to be enabled. note: 1. while in cdp mode, the data switches are on even while cdp handshaking is occurring. 2. the data line switches are off if en is low, or if in dcp mode (bc1.2 (draft), divider mode or auto-detect). they are not automatically turned of f if the power switch (in to out) is doing current li miting. with SLG55544, the data line switches are a lso off when in ?000? mode. 3. the data switches are for usb 2.0 differ ential pair only. in the case of a usb 3.0 host, the super speed differential pairs must be routed directly to the usb connec tor without passing through the SLG55544.
000-00055544-103 page 13 of 19 SLG55544 logic control modes the SLG55544 supports the listed standards above for the sd p, cdp and dcp modes using the ctl1, ctl2, and ctl3 logic i/o control pins, although their truth tables are different as sh own below. the different ctlx settings correspond to the diffe rent types of charge modes. also, using the au to-detect mode, the divider mode or bc1.2 (draft) / yd/t 1591-2009 can be automat- ically selected without external user interaction note: with the SLG55544, if the ?000? mode is se lected, the power switch will be turned off and an output discharge resistor will be connected, while the data line switches will be turned off. notes: 1. no vout discharge when charging between 1111 and 1110. 2. cdp load present governed by the smart-cdp function. SLG55544 control truth table ctl1 ctl2 ctl3 ilim_sel mode current limit settings note 0 0 0 0 discharge n/a output held low 0 0 0 1 discharge n/a output held low 0 0 1 0 dcp auto ilim_h data lines disconnected 0 0 1 1 dcp auto ilim_h data lines disconnected 0 1 0 0 sdp1 ilim_l data lines connected 0 1 0 1 sdp1 ilim_h data lines connected 0 1 1 0 dcp auto ilim_h data lines disconnected 0 1 1 1 dcp auto ilim_h data lines disconnected 100 0 dcp shorted ilim_l device forced to stay in dcp bc 1.2 charging mode 100 1 dcp shorted ilim_h device forced to stay in dcp bc 1.2 charging mode 101 0 dcp / divider1 ilim_l device forced to stay in dcp divider1 charging mode 101 1 dcp / divider1 ilim_h device forced to stay in dcp divider1 charging mode 1 1 0 0 sdp1 ilim_l data lines connected 1 1 0 1 sdp1 ilim_h data lines connected 111 0 sdp2 1 ilim_l data lines connected 111 1 cdp 1,2 ilim_h data lines connected
000-00055544-103 page 14 of 19 SLG55544 output discharge to allow a charging port to renegotiate current with a portable device, SLG55544 uses the vbus discharge function. it proceeds by turning off the power switch while discharging vout, then tu rning back on the power switch to reassert the vout voltage. this discharge function is automatically applied when a change at the ctlx lines results in any of the following mode transitio ns. ? any transition to and from cdp ? any transition to and from sdp in addition to this, can be achieved using the mode ?000?. overcurrent protection when an over-current condition is detect ed, the device maintains a constant output current and reduces the output voltage accordingly. two possible overload conditions can occur. in the first condition, the output has been shorted before the device is enabled or before vin has been applied. the SLG55544 senses the short and immediately switches into a constant-current output. in th e second condition, a short or an overload occurs while the device is enabled. at the instant the ov erload occurs, high currents may flow for nominally one to tw o microseconds before the current-limit circuit can react. the devi ce operates in constant-current mode after the current-limit c ircuit has responded. complete shutdown occurs on ly if the fault is present long enough to activate thermal limiting. the device will remain off until the junction temperature cools approximately 10c and will then re-start. the devi ce will continue to cycle on /off until the over-current condition is removed. fault# response the fault# open-drain output is asserted (a ctive low) during an over-tem perature or current limit cond ition. the output remains asserted until the fault condition is removed. the SLG55544 is designed to eliminate false fault# reporting by using an interna l deglitch circuit for current limit conditions without the need for external circuitry. this ensures that fault# is not accident ally asserted due to normal operation such as starting into a heavy capacitive load. over-temperature conditions are not deglitched and assert the fault# signal immediately. undervoltage lockout (uvlo) the undervoltage lockout (uvlo) circuit disables the power swit ch until the input voltage reaches the uvlo turn-on threshold. built-in hysteresis prevents unwanted oscillations on the output due to input voltage dr op from large current surges. thermal sense the SLG55544 protects itself with two independent thermal sensin g circuits that monitor the oper ating temperature of the power distribution switch and disables operati on if the temperature exceeds recommended o perating conditions. the device operates in constant-current mode during an over-current condition, which increases the voltage drop across power switch. the power dissipation in the package is proportional to the voltage drop ac ross the power switch, so the junction temperature rises durin g an over-current condition. the first therma l sensor turns off the power switch when the die temperature exceeds 135c and the part is in current limit. the second thermal sensor turns off th e power switch when the die temp erature exceeds 155c regardles s of whether the power switch is in curr ent limit. hysteresis is built into both thermal sensors, and the switch turns on after the device has cooled by approximat ely 10c. the switch continues to cycle off and on until t he fault is removed. the open-drain false reporting output fault# is asserted (a ctive low) during an over-temperature shutdown condition.
000-00055544-103 page 15 of 19 SLG55544 package top marking system definition part code datecode lot revision ? part id field: identifies the specific device configuration ? date code field: coded date of manufacture ? lot code: designates lot # ? assembly site/coo: specifies assembly site/country of origin ? revision code: device revision xxxxx dd lll c rr coo
000-00055544-103 page 16 of 19 SLG55544 package drawing and dimensions 16 lead tqfn package
000-00055544-103 page 17 of 19 SLG55544 tape and reel specifications tape and reel drawing and dimensions recommended reflow soldering profile please see ipc/jedec j-std-020: latest revision for reflow profile based on package volume of 6.75 mm 3 (nominal). more information can be found at www.jedec.org. package type # of pins nominal package size [mm] tape width [mm] part pitch [mm] leader (min) trailer (min) reel diameter [mm] max units pockets length [mm] pockets length [mm] per reel per box 16tqfn 16 3 x 3 x 0.75 12 8 42 336 42 336 330 5,000 10,000
000-00055544-103 page 18 of 19 SLG55544 revision history date version change 2/4/2016 1.03 fixed typos and formatting 9/8/2015 1.02 updated recommended operating conditions added recommended reflow soldering profile
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